Kabasph Additive Solutions For Electronic Paste Systems

Electronic paste systems are widely used in solar cells, displays, electronic packaging, and printed electronics. They require uniform nano particle dispersion, stable rheological properties, and reliable anti-settling performance for dense metal fillers. Key challenges include preventing agglomeration, controlling thixotropic flow, and stopping high specific gravity fillers from settling during storage. Our additives help formulators achieve stable pastes with consistent printing and dispensing performance.

• KBS-F0400 is a modified polyester dispersant for general-purpose nanofiller dispersion, carbon black and graphite, and similar materials. It provides excellent stability and uniform particle distribution in electronic pastes.
• KBS-F8600 is an acid polyester dispersant for inorganic nano-filler dispersion. It delivers excellent stability and is suitable for high-solid pastes requiring stable dispersion and low viscosity.
• KBS-F3120X is a polyamide wax paste anti-sinking agent for high specific gravity filler systems. It forms a reversible network that improves anti-settling performance and thixotropic flow during printing.
• KBS-F4100K is an organic polyurea anti-settling agent for high specific gravity fillers. It provides thixotropic rheology control, prevents sedimentation of silver or copper powders, and supports long-term storage stability.

Application Areas

Electronic paste systems are widely used where precise dispersion, controlled rheology, and reliable anti-settling performance are required. Typical application areas include:

• Conductive Silver Pastes — Used in solar cell front electrodes, membrane switches, and fine-line circuitry. These systems require uniform silver particle dispersion, stable viscosity, and strong anti-settling performance to achieve high aspect ratio printed lines and consistent conductivity.
• Copper-Based Conductive Pastes — Applied in printed electronics and low-cost conductive layers. Copper particles and glass frit must be well dispersed to prevent agglomeration, maintain stable rheological properties, and ensure proper sintering behavior.
• Aluminum Pastes — Used in solar cell back-surface fields and other conductive layers. Stable aluminum dispersion and anti-settling performance are essential for uniform paste properties and reliable electrical performance.
• Thick-Film Electronic Materials — Suitable for hybrid circuits, sensors, and electronic components. Rheology control and anti-settling properties directly influence printing resolution, film uniformity, and final device performance.
• Screen Printing Pastes — These pastes must exhibit proper thixotropic behavior to pass through the mesh under shear while rapidly rebuilding structure to maintain printed line definition and prevent edge flow.
• Dispensing Pastes — Used in electronic packaging and assembly. Stable viscosity and prevention of filter pressing during syringe dispensing are critical for accurate material deposition and consistent dot shapes.
• Fine-Line Printing Systems — Applied in high-resolution electronic features. Nanoparticle dispersion and controlled rheology enable fine-line printing with excellent electrical performance and minimal defects.

For technical data sheets, samples, or customized recommendations, please contact our technical team.